任职要求: Master with 3+ years hands-on experiences, or bachelor with 6+ years hands-on experiences, in HV, or analog electrical engineering or related fields. Hands-on experiences of electrical safety, schematic capture, schematic level simulation, PCB layout, PCB level simulation, prototyping, and problem solving. Familiar with test equipment such as multi-meter, signal / function generator, oscilloscope, signal / spectral analyzer, and network analyzer. The successful candidate should be a team player and should have self-motivation, initiative, dedication, and strong communication skills. The candidate should also have the following specific skills or experiences.High voltage and analog related application experiences, HV up to 50KVOPA circuit (board level) design and building experiences. OPA application experiencesHigh Performance Signal Conditioning circuit design and building experience for test equipment, including but not limited to ultra-low noise voltage and current amplifier, ADC driver and cable driver.Ultra-low noise and high precision PCB Layout application experiencesHigh reliability and high precision ADC and DAC application experiencesknowledge and experiences of signal integrity and power integrityMixed signal circuit (board level) design and building experiencesKnowledge of BJT, JFET and MOSFET for both switch mode and linear operationKnowledge and experiences of board level and module level shielding and grounding is a plus 职位描述: Work with line team leader and HV sub-system and analog modules architect, derive EPS, TPS and EDS for specific high voltage and analog modulesUnder less supervision and guidance, can finish difficulty products design.Design precision high voltage power supply and isolation power supply for HV system of HMI e-beam inspection toolsDesign ultra-low noise voltage and current amplifier with both highest reliability and highest precision for HMI e-beam inspection toolsDesign other critical HV submodules for HV system, such as tracker module, e-chuck module, filament current module.Design signal conditioning circuit for ADC and DAC for HV system.Conduct schematic capture, circuit simulation, PCB layoutPrepare technical documents for module manufacture and release.Conduct module prototyping, debug, and full function bench testSupport sub-system level and system level integration
在奈米技术世代之前,光学晶圆检测机台尚能克服线宽不断微缩的挑战,但在进入 90 奈米世代后,光学技术将面临瓶颈,而以电子扫描显微技术 ( E-beam ) 为核心技术的检测机台,将逐渐跃居晶圆缺陷检验之主流。1998 年,看准这个发展趋势与市场需求,在汉民科技集团 ( Hermes Epitek Corp. ) 董事长黄民奇的大力支持下,四位志同道合的顶尖科学家于美国硅谷成立 Hermes Microvision, Inc.,开始投入电子束晶圆检测设备的研发。
2003 年,集结两岸精英的研发团队,成功开发出第一台「电子束缺陷检测设备 ( E-beam Inspection Tool ) 」,以独家的跳跃式扫描检测及稳定的电子枪技术领先全球,提供业界更先进的检测设备与技术,协助客户有效提高前段制程效能,更将晶圆缺陷检验产品的技术层次,提升进入全球高科技设备与零组件供应炼中。
经营团队并于 2003 年在台湾成立企业总部--汉民微测科技股份有限公司,开始展开全球业务及营运之布局,尔后陆续于日本、韩国、中国大陆等区域设立子公司。
汉民微测秉持「帮客户解决问题,成为客户的伙伴,与客户相互信任」的原则,为策略伙伴提供解决方案,完成 90 奈米、65 奈米、40 奈米、28 奈米,乃至于 20 奈米制程的开发与量产,并继续朝16 奈米及10 奈米以下制程的检测设备推进。时至今日,汉民微测所研发、制造的电子束检测设备,其解析度及可靠度,已获得全球前二十大晶圆大厂及记忆体大厂的肯定与青睐。
汉民微测以 HMI ( Hermes Microvision, Inc. ) 为产品品牌,完整的参与了开发设计、制造、国际销售与服务,在过程中展现坚强的实力与坚定的意志。汉民微测集结两岸三地及世界各地的的顶尖技术人才,以及专业的客户服务,让汉民微测 ( HMI ) 在世界级的半导体尖端制程设备中占有一席之地,也为半导体产业发展史写下新的一页。
公司福利目前主要包括:
1.五险一金:以实际工资数额为基数,为员工缴纳五险一金
2.补充医疗保险:报销比例90%,有效缓解员工日常医药费支出;
3.年终奖及年度调薪:在公司绩效及个人绩效达到目标时,提供年终奖及年度调薪;
4.喜庆贺金:正式员工结婚及第一胎生育,公司将给予一定金额的礼品或贺金;
5.年度健康体检;
6.年度旅游;
7.工作居住证:为符合条件的优秀员工办理工作居住证;
8.各类带薪假期:年假、婚假、产假、哺乳假、陪护假、丧假、有薪病假、探亲假。